Gas-inlet module and gas-inlet nozzle

ABSTRACT

A gas-inlet module and a gas-inlet nozzle are provided. The gas-inlet has a first gas-inlet channel and a second gas-inlet channel. The first gas-inlet channel has a first end opening, the second gas-inlet channel has a second end opening, and a distance between a center point of the first end opening and a center point of the second end opening is defined as an offset distance. A value defined by an inner radius of the first end opening or an inner radius of the second end opening divided by the offset distance is within a range from 1/7 to 5/7.

FIELD OF THE DISCLOSURE

The present disclosure relates to a gas-inlet nozzle, and moreparticularly to a gas-inlet module and a gas-inlet nozzle each havingmore than one channel.

BACKGROUND OF THE DISCLOSURE

A conventional wafer cassette carrying device includes a carrier that isconfigured to carry a wafer cassette. Two gas-inlet nozzles of thecarrier are configured to implement a gas-filling process for aninterior space of the wafer cassette, and two gas-outlet nozzles of thecarrier are configured to implement a gas-suction process for theinterior space of the wafer cassette. However, the conventionalgas-inlet nozzle is limited by an existing structural design so as to bedifficult to have an improvement.

SUMMARY OF THE DISCLOSURE

In response to the above-referenced technical inadequacies, the presentdisclosure provides a gas-inlet module and a gas-inlet nozzle toeffectively improve on the issues associated with conventional gas-inletnozzles.

In one aspect, the present disclosure provides a gas-inlet module, whichincludes at least one gas-inlet nozzle. The at least one gas-inletnozzle has a first gas-inlet channel and a second gas-inlet channel. Thefirst gas-inlet channel has a first end opening. The second gas-inletchannel has a second end opening, and a distance between a center pointof the second end opening and a center point of the first end opening isdefined as an offset distance. Moreover, a value defined by an innerradius of the first end opening or an inner radius of the second endopening divided by the offset distance is within a range from 1/7 to5/7.

In another aspect, the present disclosure provides a gas-inlet nozzlehaving an inherently one-piece structure. The gas-inlet nozzle includesa first airtight structure, a second airtight structure, a firstgas-inlet channel, and a second gas-inlet channel. The first airtightstructure is arranged on a top portion of the gas-inlet nozzle and has afirst arc boundary. The first arc boundary has a center of a firstcircle and a first radius. The second airtight structure is arranged onthe top portion of the gas-inlet nozzle and has a second arc boundary.The second arc boundary has a center of a second circle and a secondradius. The first arc boundary is connected to the second arc boundaryso as to jointly define an outer airtight boundary, and the center ofthe first circle is spaced apart from the center of the second circle byan offset distance. The first gas-inlet channel has a first end opening.The first gas-inlet channel extends from the center of the first circleto penetrate through the gas-inlet nozzle. The second gas-inlet channelhas a second end opening. The second gas-inlet channel extends from thecenter of the second circle to penetrate through the correspondinggas-inlet nozzle. Moreover, a value defined by an inner radius of thefirst end opening or an inner radius of the second end opening dividedby the offset distance is within a range from 1/7 to 5/7.

Therefore, the gas-inlet module provided by the present disclosure hasthe dual-channel structure with a specific condition (e.g., the valuedefined by the inner radius of the first end opening or the inner radiusof the second end opening divided by the offset distance is within arange from 1/7 to 5/7), thereby effectively expanding the application ofgas-inlet nozzle.

These and other aspects of the present disclosure will become apparentfrom the following description of the embodiment taken in conjunctionwith the following drawings and their captions, although variations andmodifications therein may be affected without departing from the spiritand scope of the novel concepts of the disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

The described embodiments may be better understood by reference to thefollowing description and the accompanying drawings, in which:

FIG. 1 is a perspective view of a load port according to an embodimentof the present disclosure;

FIG. 2 is a perspective view showing the load port of FIG. 1 used tocarry a first wafer cassette;

FIG. 3 is a perspective view showing the load port of FIG. 1 used tocarry a second wafer cassette;

FIG. 4 is a perspective view showing the load port of FIG. 1 used tocarry a third wafer cassette;

FIG. 5 is a perspective view showing a carrying board and componentsdisposed thereon according to the embodiment of the present disclosure;

FIG. 6 is a perspective view showing the carrying board and thecomponents disposed thereon from another angle of view according to theembodiment of the present disclosure;

FIG. 7 is a top view of FIG. 5 ;

FIG. 8 is a perspective view showing a gas-inlet nozzle of FIG. 5 ;

FIG. 9 is a perspective view showing the gas-inlet nozzle of FIG. 8 fromanother angle of view;

FIG. 10 is a planar top view of FIG. 8 for depicting a first outercircular region and a second outer circular region; and

FIG. 11 is a planar top view of FIG. 8 for depicting a first innercircular region and a second inner circular region.

DETAILED DESCRIPTION OF THE EXEMPLARY EMBODIMENTS

The present disclosure is more particularly described in the followingexamples that are intended as illustrative only since numerousmodifications and variations therein will be apparent to those skilledin the art. Like numbers in the drawings indicate like componentsthroughout the views. As used in the description herein and throughoutthe claims that follow, unless the context clearly dictates otherwise,the meaning of “a”, “an”, and “the” includes plural reference, and themeaning of “in” includes “in” and “on”. Titles or subtitles can be usedherein for the convenience of a reader, which shall have no influence onthe scope of the present disclosure.

The terms used herein generally have their ordinary meanings in the art.In the case of conflict, the present document, including any definitionsgiven herein, will prevail. The same thing can be expressed in more thanone way. Alternative language and synonyms can be used for any term(s)discussed herein, and no special significance is to be placed uponwhether a term is elaborated or discussed herein. A recital of one ormore synonyms does not exclude the use of other synonyms. The use ofexamples anywhere in this specification including examples of any termsis illustrative only, and in no way limits the scope and meaning of thepresent disclosure or of any exemplified term. Likewise, the presentdisclosure is not limited to various embodiments given herein. Numberingterms such as “first”, “second” or “third” can be used to describevarious components, signals or the like, which are for distinguishingone component/signal from another one only, and are not intended to, norshould be construed to impose any substantive limitations on thecomponents, signals or the like.

Referring to FIG. 1 to FIG. 11 , a first embodiment of the presentdisclosure provides a load port 100. As shown in FIG. 1 to FIG. 4 , theload port 100 is configured for selectively carrying one of wafercassettes different from each other. The wafer cassettes in the presentembodiment include a first wafer cassette W1, a second wafer cassetteW2, and a third wafer cassette W, which are different from each other,but the present disclosure is not limited thereto.

As shown in FIG. 1 , FIG. 5 , and FIG. 6 , the load port 100 includes acarrying board 1, a gas-inlet module 2 assembled to one side of thecarrying board 1, a gas-outlet module 3 assembled to the opposite sideof the carrying board 1, a gas-filling module 4 connected to thegas-inlet module 2, and a gas-suction module 5 connected to thegas-outlet module 3, but the present disclosure is not limited thereto.For example, in other embodiments of the present disclosure not shown inthe drawings, the gas-filling module 4 and the gas-suction module 5 canbe external components that are located outside of and additionallyassembled to the load port 100.

The carrying board 1 has a carrying side 11 (e.g., a top surface of thecarrying board 1 shown in FIG. 5 ), the carrying board 1 can bestructurally designed according to assembling requirements of thegas-inlet module 2 and the gas-outlet module 3, and the carrying board 1can further have alignment mechanisms (not labeled in the drawings) forthe wafer cassettes, but the present disclosure is not limited thereto.

The gas-inlet module 2 includes two gas-inlet nozzles 21, a sharedgas-inlet valve 22, an independent gas-inlet valve 23, and two gas-inletpipes 24 a, 24 b. The two gas-inlet nozzles 21 are disposed on thecarrying side 11 of the carrying board 1. Each of the two gas-inletnozzles 21 in the present embodiment has an inherent one-piecestructure, and has a shared gas-inlet channel 211 (i.e., a firstgas-inlet channel 211) and an independent gas-inlet channel 212 (i.e., asecond gas-inlet channel 212) that is spaced apart from the sharedgas-inlet channel 211. In other words, each of the two gas-inlet nozzles21 has a structural design with dual-channel, but the present disclosureis not limited thereto. For example, in other embodiments of the presentdisclosure not shown in the drawings, any one of the two gas-inletnozzles 21 can be not integrally formed as a single one-piece structure;or, the shared gas-inlet channels 211 are formed in one of the twogas-inlet nozzles 21, and the independent gas-inlet channels 212 areformed in the other one of the two gas-inlet nozzles 21; or, thecarrying board 1 is provided with four gas-inlet nozzles 21 assembled toone side thereof. Each of the four gas-inlet nozzles 21 includes ashared gas-inlet channel 211 or an independent gas-inlet channel 212.

The shared gas-inlet valve 22 and the independent gas-inlet valve 23 arelocated under the carrying board 1 and are connected to the gas-fillingmodule 4. The shared gas-inlet valve 22 is in spatial communication withthe shared gas-inlet channels 211 of the two gas-inlet nozzles 21, andthe independent gas-inlet valve 23 is in spatial communication with theindependent gas-inlet channels 212 of the two gas-inlet nozzles 21.

In the present embodiment, the shared gas-inlet valve 22 is in spatialcommunication with the shared gas-inlet channels 211 of the twogas-inlet nozzles 21 through one of the two gas-inlet pipes 24 a, 24 b(e.g., the gas-inlet pipe 24 a), and the independent gas-inlet valve 23is in spatial communication with the independent gas-inlet channels 212of the two gas-inlet nozzles 21 through the other one of the twogas-inlet pipes 24 a, 24 b (e.g., the gas-inlet pipe 24 b).

The gas-outlet module 3 includes two gas-outlet nozzles 31, twoindependent gas-outlet nozzles 32, a first gas-outlet valve 33, a secondgas-outlet valve 34, a third gas-outlet valve 35, a first gas-outletpipe 36, a second gas-outlet pipe 37, and a third gas-outlet valve 38.The two gas-outlet nozzles 31 and the two independent gas-outlet nozzles32 are disposed on the carrying side 11 of the carrying board 1, and theindependent gas-outlet nozzles 32 are located between the two gas-outletnozzles 31.

It should be noted that the two gas-inlet nozzles 21 and the twogas-outlet nozzles 31 are respectively located at four corners of thecarrying side 11 of the carrying board 1, but the present disclosure isnot limited thereto.

In summary, as shown in FIG. 1 to FIG. 3 , the shared gas-inlet channels211 of the two gas-inlet nozzles 21 are selectively cooperated withfirst gas-outlet channels 311 of the two gas-outlet nozzles 31 so as tobe jointly configured to spatially communicate with an interior space ofthe first wafer cassette W1. Moreover, the shared gas-inlet channels 211of the two gas-inlet nozzles 21 are selectively cooperated with secondgas-outlet channels 312 of the two gas-outlet nozzles 31 so as to bejointly configured to spatially communicate with an interior space ofthe second wafer cassette W2. In other words, the two shared gas-inletchannels 211 arranged on one side of the carrying board 1 can becooperated with the four gas-outlet channels (e.g., the two firstgas-outlet channels 311 and the two second gas-outlet channels 312)arranged on the opposite side of the carrying board 1 so as to bejointly configured to spatially communicate with the interior of thefirst wafer cassette W1 or the interior space of the second wafercassette W2.

Accordingly, in the load port 100 provided by the present embodiment ofthe present disclosure, each of the two gas-outlet nozzles 31 isintegrally formed as a single one-piece structure with dual-channel, andthe two gas-outlet nozzles 31 are cooperated with the shared gas-inletchannels 211 of the two gas-inlet nozzles 21 through the firstgas-outlet channels 311 and the second gas-outlet channels 312, so thatthe two gas-outlet nozzles 31 and the two gas-inlet nozzles 21 can beapplied to the carrying board 1 having a limiting size for implementingany one of a gas-filling process and a gas-suction process to the firstwafer cassette W1 or the second wafer cassette W2, selectively.

Specifically, the gas-filling module 4 can be used to selectively fillgas into the interior space of the first wafer cassette W1 or theinterior space of the second wafer cassette W2 through the sharedgas-inlet valve 22, the corresponding gas-inlet pipe 24 a, and theshared gas-inlet channels 211 of the two gas-inlet nozzles 21.

Moreover, the gas-suction module 5 can be used to suction gas from theinterior space of the first wafer cassette W1 through the firstgas-outlet valve 33, the first gas-outlet pipe 36, and the firstgas-outlet channels 311 of the two gas-outlet nozzles 31. Furthermore,the gas-suction module 5 can be used to suction gas from the interiorspace of the second wafer cassette W2 through the second gas-outletvalve 34, the second gas-outlet pipe 37, and the second gas-outletchannels 312 of the two gas-outlet nozzles 31.

In addition, as shown in FIG. 1 and FIG. 4 , the independent gas-inletchannels 212 of the gas-inlet nozzles 21 are cooperated with thirdgas-outlet channels 321 of the two independent gas-outlet nozzles 32 soas to be jointly configured to carry the third wafer cassette W3 and tospatially communicate with an interior space of the third wafer cassetteW3. In other words, the four gas-inlet channels arranged on one side ofthe carrying board 1 (e.g., the two shared gas-inlet channels 211 andthe two independent gas-inlet channels 212) are cooperated with the sixgas-outlet channels arranged on the opposite side of the carrying board1 (e.g., the two first gas-outlet channels 311, the two secondgas-outlet channels 312, and the two third gas-outlet channels 321) soas to be jointly configured to spatially communicate with the interiorspace of the first wafer cassette W1, the second wafer cassette W2, orthe third wafer cassette W3, selectively.

Accordingly, in the load port 100 provided by the present embodiment ofthe present disclosure, each of the two gas-inlet nozzles 21 isintegrally formed as a single one-piece structure with dual-channel(e.g., the shared gas-inlet channel 211 and the independent gas-inletchannel 212), and the two gas-inlet nozzles 21 can be cooperated withthe third gas-outlet channels 321 of the two independent gas-outletnozzles 32 through the independent gas-inlet channels 212, so that thetwo gas-inlet nozzles 21 and the two independent gas-outlet nozzles 32can be applied to the carrying board 1 having a limiting size forimplementing any one of a gas-filling process and a gas-suction processto the third wafer cassette W3, but the present disclosure is notlimited thereto. For example, in other embodiments of the presentdisclosure not shown in the drawings, any one of the two gas-inletnozzles 21 can be not integrally formed as a single one-piece structure.

Specifically, the gas-filling module 4 can be used to fill gas into theinterior space of the third wafer cassette W3 through the independentgas-inlet valve 23, the corresponding gas-inlet pipe 24 b, and theindependent gas-inlet channels 212 of the two gas-inlet nozzles 21.Moreover, the gas-suction module 5 can be used to suction gas from theinterior space of the third wafer cassette W3 through the thirdgas-outlet valve 35, the third gas-outlet pipe 38, and the thirdgas-outlet channels 321 of the two independent gas-outlet nozzles 32.

It should be noted that the carrying board 1 and the nozzles (e.g., thetwo gas-inlet nozzles 21, the two gas-outlet nozzles 31, and the twoindependent gas-outlet nozzles 32) disposed thereon in the presentembodiment can be jointly defined as a multi-use carrier. Moreover, inother embodiments of the present disclosure not shown in the drawings,the multi-use carrier can be independently used (e.g., sold) or can beused in cooperation with other components.

Furthermore, the multi-use carrier provided by the present disclosurecan be used for the wafer cassettes in N number of models. Specifically,N is a positive integer, and N in the present embodiment is three.

In the present embodiment, the structural arrangement and thecooperation of the gas-inlet module 2 and the gas-outlet module 3 aredescribed as the above description, but the present disclosure is notlimited thereto. For example, in other embodiments of the presentdisclosure not shown in the drawings, at least one of the independentgas-inlet valve 23, the two gas-inlet pipes 24 a, 24 b, the twoindependent gas-outlet nozzles 32, the third gas-outlet valve 35, thefirst gas-outlet pipe 36, the second gas-outlet pipe 37, and the thirdgas-outlet pipe 38 can be omitted or can be replaced by other componentsaccording to design requirements.

The above description describes the configuration of the load port 100,but each of the two gas-inlet nozzles 21 having dual-channel (e.g., theshared gas-inlet channel 211 and the independent gas-inlet channel 212)needs to meet a high airtight requirement. Accordingly, any one of thetwo gas-inlet nozzles 21 in the present embodiment can utilize thedual-channel to be a part of an airtight structure by the followingstructural designs, thereby meeting the high airtight requirement.

As shown in FIG. 8 and FIG. 9 , as the two gas-inlet nozzles 21 in thepresent embodiment are of the substantially same structure, thefollowing description discloses the structure of just one of the twogas-inlet nozzles 21 for the sake of brevity, but the present disclosureis not limited thereto. For example, in other embodiments of the presentdisclosure not shown in the drawings, the two gas-inlet nozzles 21 canbe of different structures; or, the gas-inlet nozzle 21 can beindependently used (e.g., sold) or can be used in cooperation with othercomponents.

In the present embodiment, the shared gas-inlet channel 211 can bereferred to a first gas-inlet channel 211, the independent gas-inletchannel 212 can be referred to a second gas-inlet channel 212, and eachof the shared gas-inlet valve 22 and the independent gas-inlet valve 23can be referred to a gas-inlet valve 22, 23. In other words, one of thetwo gas-inlet valves 22, 23 (e.g., the shared gas-inlet valve 22) is inspatial communication with the first gas-inlet channels 211 of the twogas-inlet nozzles 21, and the other one of the two gas-inlet valves 22,23 (e.g., the independent gas-inlet valve 23) is in spatialcommunication with the second gas-inlet channels 212 of the twogas-inlet nozzles 21.

As shown in FIG. 8 , FIG. 10 , and FIG. 11 , a top portion of thegas-inlet nozzle 21 in the present embodiment includes a first airtightstructure 213, a second airtight structure 214 connected to the firstairtight structure 213, and a carrying stage 215 that is arranged insideof the first airtight structure 213 and the second airtight structure214. In the present embodiment, a top edge of the first airtightstructure 213, a top edge of the second airtight structure 214, and atop edge of the carrying stage 215 are coplanar with each other, and areconfigured to be gaplessly abutted against any one of the first wafercassette W1, the second wafer cassette W2, and the third wafer cassetteW3.

Moreover, the gas-inlet nozzle 21 can be a mirror-symmetrical structure(e.g., the first airtight structure 213 and the second airtightstructure 214 are symmetrical to each other), but the present disclosureis not limited thereto. For example, in other embodiments of the presentdisclosure not shown in the drawings, the first airtight structure 213and the second airtight structure 214 of the gas-inlet nozzle 21 can beof different structures; or, the carrying stage 215 of the gas-inletnozzle 21 can be omitted or can be replaced by other components; or, thegas-inlet nozzle 21 can be formed with just one airtight structurehaving an outer airtight boundary.

Specifically, the first airtight structure 213 includes a first outerC-shaped rib 2131 and a first inner C-shaped rib 2132 that is spacedapart from or parallel to the first outer C-shaped rib 2131. The firstinner C-shaped rib 2132 is located between the first outer C-shaped rib2131 and the carrying stage 215. Furthermore, two ends of the firstouter C-shaped rib 2131 are connected to the carrying stage 215, and anouter edge of the first outer C-shaped rib 2131 defines a first arcboundary 2131 a that has a center of a first circle C1 and a firstradius R1. Two ends of the first inner C-shaped rib 2132 are connectedto the carrying stage 215, and the first inner C-shaped rib 2132 has acenter of a circle that is overlapped with the center of the firstcircle C1.

Moreover, the second airtight structure 214 includes a second outerC-shaped rib 2141 and a second inner C-shaped rib 2142 that is spacedapart from or parallel to the second outer C-shaped rib 2141. The secondinner C-shaped rib 2142 is located between the second outer C-shaped rib2141 and the carrying stage 215. Furthermore, two ends of the secondouter C-shaped rib 2141 are connected to the carrying stage 215, and anouter edge of the second outer C-shaped rib 2141 defines a second arcboundary 2141 a that has a center of a second circle C2 and a secondradius R2. Two ends of the second inner C-shaped rib 2142 are connectedto the carrying stage 215, and the second inner C-shaped rib 2142 has acenter of a circle that is overlapped with the center of the secondcircle C2.

Specifically, the first outer C-shaped rib 2131 is connected to (orintersected with) the second outer C-shaped rib 2141 and the secondinner C-shaped rib 2142, and the first arc boundary 2131 a is connectedto the second arc boundary 2141 a so as to jointly define an outerairtight boundary. Moreover, the first inner C-shaped rib 2132 isconnected to (or intersected with) the second outer C-shaped rib 2141and the second inner C-shaped rib 2142, and an outer edge 2132 a of thefirst inner C-shaped rib 2132 is connected to an outer edge 2142 a ofthe second inner C-shaped rib 2142 so as to jointly define an innerairtight boundary. Any one of a first end opening 2111 of the firstgas-inlet channel 211 and a second end opening 2121 of the secondgas-inlet channel 212 in the present embodiment is a circular hole, sothat the C-shaped ribs (e.g., the first outer C-shaped rib 2131, thefirst inner C-shaped rib 2132, the second outer C-shaped rib 2141, andthe second inner C-shaped rib 2142) can provide a better airtighteffect.

The center of the first circle C1 is spaced apart from the center of thesecond circle C2 by an offset distance L that is less than the firstradius R1 and that is less than the second radius R2, but the presentdisclosure is not limited thereto. In the present embodiment, the firstradius R1 is equal to the second radius R2, and the offset distance L ispreferably within a range from 55% to 60% of the first radius R1. Inother embodiments of the present disclosure not shown in the drawings,the offset distance L can be greater than at least one of the firstradius R1 and the second radius R2.

In the present embodiment, the carrying stage 215 is located at an innerside of the outer airtight boundary and is also located at an inner sideof the inner airtight boundary. An outer edge of the carrying stage 215includes two straight edges 2151, a first arc edge 2152, and a secondarc edge 2153. The two straight edges 2151 are parallel to each other,and the two straight edges 2151 are respectively connected to the twoends of the first inner C-shaped rib 2132 and are respectively connectedto the two ends of the second inner C-shaped rib 2142.

Two ends of the first arc edge 2152 are respectively connected to oneend of the two straight edges 2151 and are respectively connected to thetwo ends of the second outer C-shaped rib 2141 (e.g., any one of the twoends of the second outer C-shaped rib 2141 is connected to a junction ofthe first arc edge 2152 and the corresponding straight edge 2151).Specifically, the first arc edge 2152 has a center of a circle that isoverlapped with the center of the first circle C1, and any two of thefirst arc edge 2152, the outer edge 2132 a of the first inner C-shapedrib 2132, and the first arc boundary 2131 a adjacent to each other arespaced apart from each other by a same distance, but the presentdisclosure is not limited thereto (e.g., the first arc edge 2152, theouter edge 2132 a, and the first arc boundary 2131 a can be spaced apartfrom each other by different distances).

Two ends of the second arc edge 2153 are respectively connected toanother one end of the two straight edges 2151 and are respectivelyconnected to the two ends of the first outer C-shaped rib 2131 (e.g.,any one of the two ends of the first outer C-shaped rib 2131 isconnected to a junction of the second arc edge 2153 and thecorresponding straight edge 2151). Specifically, the second arc edge2153 has a center of a circle that is overlapped with the center of thesecond circle C2, and any two of the second arc edge 2153, the outeredge 2142 a of the second inner C-shaped rib 2142, and the second arcboundary 2141 a adjacent to each other are spaced apart from each otherby a same distance, but the present disclosure is not limited thereto(e.g., the second arc edge 2153, the outer edge 2142 a, and the secondarc boundary 2141 a can be spaced apart from each other by differentdistances).

The first gas-inlet channel 211 (i.e., the shared gas-inlet channel 211)extends from the center of the first circle C1 to penetrate through thegas-inlet nozzle 21, and the first end opening 2111 of the firstgas-inlet channel 211 is arranged on the carrying stage 215. Moreover,the first end opening 2111 is at least partially located in a secondouter circular region A2141 a defined by the second arc boundary 2141 a,and is at least partially located in a second inner circular regionA2142 a defined by the outer edge 2142 a of the second inner C-shapedrib 2142.

The second gas-inlet channel 212 (i.e., the independent gas-inletchannel 212) extends from the center of the second circle C2 topenetrate through the gas-inlet nozzle 21, and the second end opening2121 of the second gas-inlet channel 212 is arranged on the carryingstage 215. Moreover, the second end opening 2121 is at least partiallylocated in a first outer circular region A2131 a defined by the firstarc boundary 2131 a, and is at least partially located in a first innercircular region A2132 a defined by the outer edge 2132 a of the firstinner C-shaped rib 2132.

In addition, the offset distance L of the present embodiment can bedefined by a distance between a center point of the second end opening2121 and a center point of the first end opening 2111, and a valuedefined by an inner radius of the first end opening 2111 (or an innerradius of the second end opening 2121) divided by the offset distance Lis within a range from 1/7 to 5/7. For example, the inner radius of thefirst end opening 2111 or the inner radius of the second end opening2121 can be within a range from 1 mm to 5 mm, and the offset distance Lcan be 7 mm.

Specifically, the first end opening 2111 and the second end opening 2121are located in an overlapped region of the first outer circular regionA2131 a and the second outer circular region A2141 a, and two endportions of the carrying stage 215 (e.g., the two end portionsrespectively have the first arc edge 2152 and the second arc edge 2153)are respectively located at two opposite sides of the overlapped region.Moreover, at least 90% area of any one of the first end opening 2111 andthe second end opening 2121 is located in the overlapped region of thefirst inner circular region A2132 a and the second inner circular regionA2142 a.

In summary, as shown in FIG. 1 to FIG. 3 and FIG. 10 , when the topportions of the two gas-inlet nozzles 21 are abutted against the firstwafer cassette W1 or the second wafer cassette W2, in each of the twogas-inlet nozzles 21, the shared gas-inlet channel 211 and the sharedgas-inlet valve 22 are configured to allow an airflow to flow into theinterior space of the first wafer cassette W1 or the second wafercassette W2, and the independent gas-inlet channel 212 is cooperatedwith the independent gas-inlet valve 23, the outer airtight boundary,and the inner airtight boundary so as to jointly prevent the airflowfrom passing therethrough (e.g., the independent gas-inlet valve 23 isenclosed at this time).

Moreover, as shown in FIG. 1 , FIG. 4 , and FIG. 10 , when the topportions of the two gas-inlet nozzles 21 are abutted against the thirdwafer cassette W3, in each of the two gas-inlet nozzles 21, theindependent gas-inlet channel 212 and the independent gas-inlet valve 23are configured to allow an airflow to flow into the interior space ofthe third wafer cassette W3, and the shared gas-inlet channel 211 iscooperated with the shared gas-inlet valve 22, the outer airtightboundary, and the inner airtight boundary so as to jointly prevent theairflow from passing therethrough (e.g., the shared gas-inlet valve 22is enclosed at this time).

In summary, as shown in FIG. 1 to FIG. 4 and FIG. 10 , when the topportions of the two gas-inlet nozzles 21 are abutted against one of thewafer cassettes, in each of the two gas-inlet nozzles 21, any one of thefirst gas-inlet channel 211 and the second gas-inlet channel 212 iscooperated with the corresponding gas-inlet valve 22, 23 so as to bejointly configured to allow an airflow to flow into an interior space ofthe one of the wafer cassettes, and the other one of the first gas-inletchannel 211 and the second gas-inlet channel 212 is cooperated with thecorresponding gas-inlet valve 22, 23, the outer airtight boundary, andthe inner airtight boundary so as to jointly prevent the airflow frompassing therethrough.

Accordingly, the gas-inlet nozzle 21 in the present embodiment has thedual-channel structure and can be designed with the above structuralarrangement on the top portion thereof (e.g., the first arc boundary2131 a is connected to the second arc boundary 2141 a so as to jointlydefine the outer airtight boundary; the first end opening 2111 is atleast partially located in the second outer circular region A2141 a; andthe second end opening 2121 is at least partially located in the firstouter circular region A2131 a), so that the shared gas-inlet channel 211and the independent gas-inlet channel 212 can be used as airtightstructures for each other, thereby meeting the high airtight requirementduring the gas-filling process.

Beneficial Effects of the Embodiment

In conclusion, in the load port and the multi-use carrier provided bythe present disclosure, the four gas-outlet channels and the two sharedgas-inlet channels are cooperated with each other for being applied tothe carrier having a limiting size, thereby being capable ofimplementing any one of the gas-filling process and the gas-suctionprocess to the first wafer cassette or the second wafer cassette,selectively.

Moreover, the load port and the multi-use carrier provided by thepresent disclosure can further have the two independent gas-inletchannels arranged on the carrying board having the limiting size forbeing cooperated with the two third gas-outlet channels, thereby beingcapable of implementing any one of the gas-filling process and thegas-suction process to the third wafer cassette.

Furthermore, the gas-inlet module provided by the present disclosure hasthe dual-channel structure with a specific condition (e.g., the valuedefined by the inner radius of the first end opening or the inner radiusof the second end opening divided by the offset distance is within arange from 1/7 to 5/7), thereby effectively expanding the application ofthe gas-inlet nozzle. Specifically, the gas-inlet module provided by thepresent disclosure has the dual-channel structure and can be designedwith the above structural arrangement on the top portion thereof, sothat the shared gas-inlet channel and the independent gas-inlet channelcan be used as airtight structures for each other, thereby meeting thehigh airtight requirement during the gas-filling process.

The foregoing description of the exemplary embodiments of the disclosurehas been presented only for the purposes of illustration and descriptionand is not intended to be exhaustive or to limit the disclosure to theprecise forms disclosed. Many modifications and variations are possiblein light of the above teaching.

The embodiments were chosen and described in order to explain theprinciples of the disclosure and their practical application so as toenable others skilled in the art to utilize the disclosure and variousembodiments and with various modifications as are suited to theparticular use contemplated. Alternative embodiments will becomeapparent to those skilled in the art to which the present disclosurepertains without departing from its spirit and scope.

What is claimed is:
 1. A gas-inlet module, comprising: at least onegas-inlet nozzle including: a first gas-inlet channel having a first endopening; and a second gas-inlet channel having a second end opening,wherein a distance between a center point of the second end opening anda center point of the first end opening is defined as an offsetdistance; wherein a value defined by an inner radius of the first endopening or an inner radius of the second end opening divided by theoffset distance is within a range from 1/7 to 5/7.
 2. The gas-inletmodule according to claim 1, wherein the at least one gas-inlet nozzleincludes at least one airtight structure arranged on a top portionthereof, and wherein the at least one airtight structure has an outerairtight boundary and surrounds the first gas-inlet channel and thesecond gas-inlet channel.
 3. The gas-inlet module according to claim 1,wherein a quantity of the at least one gas-inlet nozzle is two, and atop portion of each of the two gas-inlet nozzles includes: a firstairtight structure having a first arc boundary, wherein the first arcboundary has a center of a first circle and a first radius; and a secondairtight structure having a second arc boundary, wherein the second arcboundary has a center of a second circle and a second radius, andwherein the first arc boundary is connected to the second arc boundaryso as to jointly define an outer airtight boundary, and the center ofthe first circle is spaced apart from the center of the second circle bythe offset distance.
 4. The gas-inlet module according to claim 3,further comprising: two gas-inlet valves, wherein one of the twogas-inlet valves is in spatial communication with the first gas-inletchannels of the two gas-inlet nozzles, and the other one of the twogas-inlet valves is in spatial communication with the second gas-inletchannels of the two gas-inlet nozzles; wherein, when the top portions ofthe two gas-inlet nozzles are abutted against a wafer cassette, in eachof the two gas-inlet nozzles, one of the first gas-inlet channel and thesecond gas-inlet channel is cooperated with the corresponding gas-inletvalve so as to be jointly configured to allow an airflow to flow into aninterior space of the wafer cassette, and the other one of the firstgas-inlet channel and the second gas-inlet channel is cooperated withthe corresponding gas-inlet valve and the outer airtight boundary so asto jointly prevent the airflow from passing therethrough.
 5. Thegas-inlet module according to claim 4, wherein, in each of the twogas-inlet nozzles, the first gas-inlet channel extends from the centerof the first circle to penetrate through the corresponding gas-inletnozzle, the first end opening is at least partially located in a secondouter circular region defined by the second arc boundary, the secondgas-inlet channel extends from the center of the second circle topenetrate through the corresponding gas-inlet nozzle, and the second endopening is at least partially located in a first outer circular regiondefined by the first arc boundary.
 6. The gas-inlet module according toclaim 4, wherein the top portion of each of the two gas-inlet nozzlesincludes a carrying stage located at an inner side of the outer airtightboundary, and wherein, in each of the two gas-inlet nozzles, the firstend opening and the second end opening are arranged on the carryingstage.
 7. The gas-inlet module according to claim 4, wherein, in each ofthe two gas-inlet nozzles, the first airtight structure includes a firstouter C-shaped rib having the first arc boundary, the second airtightstructure includes a second outer C-shaped rib having the second arcboundary, and two ends of the first outer C-shaped rib and two ends ofthe second outer C-shaped rib are connected to the carrying stage. 8.The gas-inlet module according to claim 7, wherein, in each of the twogas-inlet nozzles, the first airtight structure includes a first innerC-shaped rib arranged between the carrying stage and the first outerC-shaped rib, the first inner C-shaped rib has a center of circle thatis overlapped with the center of the first circle, and the first innerC-shaped rib is connected to the second outer C-shaped rib, and wherein,in each of the two gas-inlet nozzles, the second airtight structureincludes a second inner C-shaped rib arranged between the carrying stageand the second outer C-shaped rib, the second inner C-shaped rib has acenter of circle that is overlapped with the center of the secondcircle, and the second inner C-shaped rib is connected to the firstouter C-shaped rib.
 9. The gas-inlet module according to claim 8,wherein, in each of the two gas-inlet nozzles, an outer edge of thefirst inner C-shaped rib is connected to an outer edge of the secondinner C-shaped rib so as to jointly define an inner airtight boundary,the outer edge of the first inner C-shaped rib defines a first innercircular region, the outer edge of the second inner C-shaped rib definesa second inner circular region that is partially overlapped with thefirst inner circular region, and at least 90% area of any one of thefirst end opening and the second end opening is located in an overlappedregion of the first inner circular region and the second inner circularregion.
 10. A gas-inlet nozzle having an inherent one-piece structure,comprising: a first airtight structure arranged on a top portion of thegas-inlet nozzle and having a first arc boundary, wherein the first arcboundary has a center of a first circle and a first radius; a secondairtight structure arranged on the top portion of the gas-inlet nozzleand having a second arc boundary, wherein the second arc boundary has acenter of a second circle and a second radius, and wherein the first arcboundary is connected to the second arc boundary so as to jointly definean outer airtight boundary, and the center of the first circle is spacedapart from the center of the second circle by an offset distance; afirst gas-inlet channel having a first end opening, wherein the firstgas-inlet channel extends from the center of the first circle topenetrate through the gas-inlet nozzle; and a second gas-inlet channelhaving a second end opening, wherein the second gas-inlet channelextends from the center of the second circle to penetrate through thegas-inlet nozzle, and wherein a value defined by an inner radius of thefirst end opening or an inner radius of the second end opening dividedby the offset distance is within a range from 1/7 to 5/7.